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Abstract

Understanding the interfacial heat transport mechanisms in Ti3C2Tx–copper nanocomposites is essential for developing advanced Thermal Interface Materials (TIM) for electronic and energy systems. This study provides atomistic insights into how MXene surface terminations (–O, –OH, –F), copper crystallographic orientations ((111), (100), (110)), and MXene layer thickness influence thermal conductivity and interfacial thermal resistance. O-terminated MXene exhibited the strongest interfacial adhesion (∼0.45 J/m2) and the highest thermal conductivity (∼68 W/m· K), while F-terminated MXene showed the weakest interfacial bonding and poorest heat transfer (∼45 W/m· K). Increasing the MXene thickness introduced additional phonon scattering, leading to a conductivity reduction of up to 12% compared with the monolayer case. Moreover, raising the temperature from 300 K to 700 K caused a non-linear conductivity decline due to enhanced Umklapp scattering. These findings establish critical structure–property relationships for tailoring MXene–metal interfaces in high-performance heat management applications. Non-Equilibrium Molecular Dynamics (NEMD) simulations were performed using the LAMMPS package. Ti3C2Tx–Cu interface models were constructed with various surface terminations and Cu orientations. Interatomic interactions were described using ReaxFF for MXene, EAM for copper, and Lennard–Jones plus Coulombic terms for interfacial coupling. This hybrid force-field scheme was selected to capture both the reactive chemistry of MXene surface groups and the metallic bonding in copper while retaining computational efficiency. A constant heat flux was imposed using the Müller–Plathe algorithm, and thermal conductivity was calculated from Fourier's law. Radial distribution functions, adhesion energies, and temperature profiles were analyzed to evaluate bonding characteristics and phonon transport. Structural stability and temperature dependence were further assessed under canonical (NVT) and isothermal–isobaric (NPT) ensembles.

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